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Deepak Sharma

Deepak Sharma
Deepak Sharma
Assistant Professor
Centre/School/Special Centre
School of Engineering
Residence
8861544361
Email
deepaksharma[at]mail[dot]jnu[dot]ac[dot]in, dsharma7309[at]gmail[dot]com
Personal Webpage
https://scholar.google.com/citations?user=Wxa1zu0AAAAJ&hl=en&authuser=1
Qualifications

Ph.D.:  Department of Materials Engineering, Indian Institute of Science, Bangalore, India.

MSc Engg..: Department of Materials Engineering, Indian Institute of Science, Bangalore, India.

B.Tech.: Department of Mechanical Engineering, National Institute of Technology, Hamirpur, India

Areas of Interest/Specialization

Mechanical behavior of materials, Fracture Mechanics, Finite Element Method, Micro-machining, Thermal interface materials

Experience

September 2020 - till date: Assistant Professor, School of Engineering, Jawaharlal Nehru University, Delhi, India.

July 2019 - August 2020: Assistant Professor, Mechanical Engineering,  BITS PIlani, Pilani, India.

January 2019 - June 2019: Research Associate, Aerospace Engineering, IISc Bangalore, India.

June 2018-December 2019: Research Associate, Materials Engineering, IISc Bangalore, India.

Awards & Honours
  1. Best oral presentation award, NMD-ATM conference, BITS Goa, 2018
  2. Indian structural integrity Society (InSIS) scholarship for research paper presentation in ICF-14, Greece.
  3. Received IISc Bangalore (MHRD) institute fellowship [2012-2017].
  4. Received IISc Bangalore research associate fellowship [2017-2018].
International Collaboration/Consultancy

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Best Peer Reviewed Publications
  1. D. Sharma, and P. Kumar, "Failure of Thin Metallic Conductors under Electric Current Loading: Transition from Sharp Crack to Blow-hole," Engineering Fracture Mechanics, 208, 221-237, 2019.
  2. D. Sharma, S. B. Reddy, and P. Kumar, "Electromagnetic force induced fracture of pre-cracked thin metallic conductors," International Journal of Fracture, Vol. 212, Issue 2, pp 183-204, 2018.
  3. D. Sharma, S. B. Reddy, and P. Kumar, "Fracture of Pre-Cracked Metallic Conductors under Combined Electric Current and Mechanical Loading," International Journal of Fracture, Vol. 212, Issue 2, pp 167-182, 2018.
  4. D. Sharma, A. Jain, N. Somaiah, R. Sharma, P.R. Narayanan, P. Kumar, “Effect of Embedding Cu-Graphene Hybrid Powder into 2-Phase In-Cu Solders on Its Suitability as Metallic Thermal Interface Material” Journal of Electronic Materials, 47, Issue 8, pp 4863–4874, 2018.
  5. D. Sharma, R.K. Tiwari, R. Sharma, P.R. Narayanan, P. Kumar, “Two-Phase Metallic Thermal Interface Materials Processed through Liquid Phase Sintering followed by Accumulative Roll Bonding,”IEEE Trans. Compon. Pack., 6, Issue 1, pp 58–66, 2015.
Recent Peer Reviewed Journals/Books

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